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Dimensions & Weight
230x245x370 [mm] (WxHxL)
with base and mounts
Weight approx.12Kg with mount and shock isolators
CMC-e Brochure
EQT Report
RFI/EMI Report
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Major Assemblies
- Power Supply Assy.
- Com Express CPU module Dual
or Quad Core i7
- NVIDIA or Radeon
Display Controller on PCI-e x16
- Passive back plane
- Custom made Connector's Panel.
- Internal Flash Disk
- Removable disk |
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Power Supply
The Power Supply is a
Plug-In LRU with the
following characteristics
Power In: 18-32VDC per
MIL 1275B, and
MIL-STD-704A approx. 3Amp.
Hold-Up time minimum 100msec. |
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Typical Configuration
The following represents a typical configuration
of the CMC-e CPU.
- CPU - Intel® Dual Core™ i7-620LE,
2.00 GHz
- CACHE - 2
Cache:
L1 cache 24KB data/32 KB instruction
L2 cache up to 4 MBytes, 8-way
- Internal Disk: SATA,
8GB Flash
- Removable
Disk
SATA, 500GB Hard Disk or up to 256GB Flash.
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Ethernet - 4 x 10/100/1000Base-T.
- USB -
6 x USB 2.0
- Up to
8 x RS-232/RS-422
-
Programmable Hardware Watch dog
- Voice
In/Out
-
Aptio BIOS © 2009 American Megatrends, Inc.
- MIL-STD-1553 - Dual
Channels
- ARINC-429
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Graphic Options
Option A
Use of
internal integrated Graphics: Intel® Graphics Media Accelerator
4500(Intel® GMA 4500)
Option B
Use of
NVIDIA or ATI Radeon PCI-e x16 Board ,
Option C
STANAG 3350 A, B, C, RS-170, RS-343,
External Sync,
Video In - RS-170
Expansion Slots
- Up to
3 3/4f Size PCI boards
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PCI-e x16, PCI-e x4, PCI-e x1
External Connectors
External Connectors are customized per request
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CMC-e Construction
The CMC-e is designed and
constructed in accordance with the general requirements of
MIL-STD-454.
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Moisture & Fungus Resistance
CMC-e assemblies are moisture
resistant and are not nutrients for fungi. The PC Cards are treated with
Conformal coating for protection. The coating conforms to MIL-I-46058C.
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Thermal Design
The cooling of the
components on the CMC-e cards is accomplished by conduction. The cooling
of the CMC-e Power Supply and the Pentium chip are accomplished by by
conduction through the aluminum enclosure of the unit which is
built as an heat-sink.
External Connectors
External connectors are used
for interfacing with the subassemblies or equipment and are in
accordance with requirement of MIL-STD-454. Connector mating bodies are
keyed, and keyed locations are varied to prevent improper
installation. |
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External Finishes
The computer external surfaces
are chemically treated prior to painting. All residues and
contaminants are removed prior to applying one coat of primer. The finish
is semi-gloss per FED-STD-595.
Processes and Treatment
Processes and treatments
(welding, soldering, brazing and corrosion (resistance
protection) of the enclosure is in accordance with MIL-STD-454.
Identification and Marking
The marking and labels of the
equipment meet the requirements of MIL-M-13231.
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Environmental
Conditions
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Temperature
The CMC-e will not
be damaged or affected by the effects of ambient air temperature as
follows:
Operating
The CMC-e
shall meet performance requirements specified herein after exposure
to temperatures:
With Core 2 Duo CPU,
operation from -40°C to + 71°C.
With Dual Core i7, operation from
-40°C to + 71°C.
With Quad Core i7, operation from
-20°C to + 60°C. |
(Storage and
transportation) -40° to 85°C.
Sand and Dust
The CMC-e shall operate as
specified herein while and after being subjected to sand and dust as
encountered in dry arid arias. The CMC-e shall meet the requirements
specified in MIL-STD-810F.
Salt Fog
The CMC-e is resistant
to the corrosive effects of salt fog environment. The CMC-e meets
the requirements specified in MIL-STD-810E Method 509.3 Procedure I. The
base metal shall not be visible through the finish or coating, nor
shall be any evidence of blistering, softening, separation from
the base metal, corrosion products, or other coating failure.
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Relative humidity
Up to 95% relative
humidity, non-condensing, per
MIL-STD-810F
Salt Fog
5% solution per
MIL-STD-810F method 509.3
Vibrations
MIL-STD-810F Method 514.5 Procedure I
Shock
MIL-STD-810F for flight equipment 40g,11ms saw tooth
Altitude
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With standard hard disks
up to 15,000ft
(or the equivalent atmospheric pressure),
operating
and non-operating
- With Flash disks up to
40,000ft (or the
equivalent
atmospheric pressure), operating
and
non-operating
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Electromagnetic Interference
The CMC-e as specified
with its internal boards, and the computer’s components, disks and
power supplies complies the requirements of MIL-STD-461F as follows:
CE102
Conducted emissions, power
leads, 10 kHz to 10 MHz.
RE102
Radiated emissions, electric
field, 100 kHz to 1.0 GHz.
RS103
Radiated susceptibility,
electric field, 2 MHz to 2.0 GHz.
CS114
Conducted susceptibility, DC
cable injection, 10 kHz to 400MHz.
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Maintainability
Interchangeability
The components of the CMC-e
are physically and functionally interchangeable in accordance with
MIL-STD-454. Parts or components of the same part number procured to this
specification are physically and functionally interchangeable without
selection, adjustment or fit.
Maintainability and Modularization
The CMC-e is designed
such that it is completely maintainable by replacement of assemblies.
Maximum use is made of plug in
module assemblies.
Reliability
The CMC-e -PC has an MTBF of
10,000 hours at 25°C . Mean Time To Repair (MTTR) does not exceed 30 minutes.
The MTTR includes the time required to detect and isolate the failure,
replace the failed unit, checkout the repair and return the system to full
operational status.
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Copyright © 2012.
BES Systems Ltd. 6B Tfuzot Israel St. Givataim 53583 Israel, CAGE
SK477
Tel: +972-3-5714998
Fax:+972-3-571-5085 email:
asherlav@bes.co.il
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BES Electronic Systems
